Materializing quantitative solder joint inspection, whilst minimizing the risks of overlooked defects defined by the quality criteria, and contributing to a vertical startup.
VT-S730
產品特色
Omron's 3D-SJI (Solder Joint Inspection) Ensuring High-quality Products in an Efficient Manufacturing Environment
Omron's 3D-SJI (Solder Joint Inspection)
Example Defects
Support for statistical inspection required by IATF (ISO/TS) 16949
Support to quantitatively evaluate measurement for MSA (Measurement System Analysis).
Maintain inspection accuracy by continuously measuring and evaluating accuracy automatically while recording history.
Whole PCB surface inspection
Detecting foreign objects accurately is achieved through combining 3D (height) and 2D (area) measurements on the entire PCB surface. (Lands without solder can be excluded from the inspection)
Oblique viewing camera incorporated
Oblique view inspections can be performed on solder joints that are hidden from the direct view camera.
Various Lineup of High-Speed Models
The VT-S730-H incorporates a high-speed image capturing module to substantially reduce the inspection time compared to standard models of the same series.
Comparison of inspection time of Omron's PCB (example)
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Hardware configuration
| Model | S730 | S730-H | |
|---|---|---|---|
| Dimensions | 1100 (W) × 1470 (D) × 1500 (H) mm | ||
| Weight | Approx. 800 kg | ||
| Power supply | Voltage | 200 - 240 VAC (single phase), voltage fluctuation range ±10% | |
| Normal rated power | 2.8 kVA | 2.4 kVA | |
| Line height | 900 ±20 mm | ||
| Air supply pressure | 0.3 - 0.6 MPa | ||
| Operating temperature range | 10 - 35°C | ||
| Operating humidity range | 35 - 80%RH (Non-condensing) | ||
| Image signal input block |
Imaging system | 4M pixel camera | 12M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology | ||
| Image resolution | 15 μm | ||
| FOV | 30.00 × 30.72 mm | 61.44 × 46.08 mm | |
Functional specifications
| Model | S730 | S730-H |
|---|---|---|
| Supported PCB size | 50 (W) × 50 (D) - 510 (W) × 460 (D) mm | |
| Thickness | 0.4 - 4 mm | |
| Clearance | Above: 40 mm; Below: 40 mm | |
| Height measurement range | 25 mm | |
| Inspection item | Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge |
|
（單位：mm）
English
Global Edition
| Catalog Name | Catalog Number [size] |
Last Update | |
|---|---|---|---|
 VT-S730 Series Catalog |
Q325-E1-04 [2866KB] |
Apr 15, 2019
20190415
|
VT-S730 Series Catalog |
