Materializes quantitative inspection of solder joint and implementation, while minimizing risks of overlooking unknown defects by the quality product criteria inspection based on the standards, contributing to vertical startup of inspection.
VT-S530
產品特色
Omron's 3D-SJI (Solder Joint Inspection) Ensuring High-quality Products in an Efficient Manufacturing Environment
Omron's 3D-SJI (Solder Joint Inspection)
Example Defects
Whole PCB surface inspection
Detecting foreign objects accurately is achieved through combining 3D (height) and 2D (area) measurements on the entire PCB surface. (Lands without solder can be excluded from the inspection)
High productivity inspection
High production throughput supported through dual lane.
Dual lane operation using various PCBs is possible, due to its handling capability up to the PCB size of 510 (W) x 330 (D) mm.
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Hardware configuration
| Dimensions | 1180(W)×1640 (D)×1500(H) mm | |
|---|---|---|
| Weight | Approx. 850kg | |
| Power supply | Voltage | 200 - 240VAC (single phase), voltage fluctuation range ±10% |
| Normal rated power | 2.0kVA | |
| Line height | 900±20mm | |
| Air supply pressure | 0.3 - 0.6MPa | |
| Operating temperature range | 10 - 35°C | |
| Operating humidity range | 35 - 80%RH (Non-condensing) | |
| Image signal input block |
Imaging system | 12M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
| Image resolution | 10μm/15μm | |
| FOV | 10μ: 40×30mm | |
| 15μ: 60×45mm | ||
Functional specifications
| Supported PCB size (min.) | 50(W)×50(D)mm |
|---|---|
| Supported PCB size (max.) | Dual lane: 510(W)×330(D)mm |
| Single lane: 510(W)×680(D)mm | |
| Clearance | Above: 50mm; Below: 50mm |
| Height measurement range | 25mm |
| Thickness | 0.4 - 4mm |
| Inspection item | Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge |
（單位：mm）
English
Global Edition
| Catalog Name | Catalog Number [size] |
Last Update | |
|---|---|---|---|
 VT-S530 Catalog |
Q330-E1-05 [3764KB] |
Apr 15, 2019
20190415
|
VT-S530 Catalog |
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